Flip chip is a kind of pin free structure, which usually contains circuit units. Designed to be connected to the circuit electrically and mechanically by a suitable number of tin balls (covered by conductive adhesive) located on its surface.

Our company currently has two kinds of flip chip bonding technology:
1) Solder paste process: pre-print the solder paste on pads, mount the component on the PCB, followed by reflow soldering

2) Flux dipping process: partially submerge pins of the Flip Chip into a flux reservoir, mount the component on the PCB, followed by reflow soldering